PIOTEC’s card personalization machines integrate multiple core technologies developed through independent R&D, including full system design, system integration capabilities, high-speed industrial readers, vision recognition systems, and precision laser marking technology. These innovations ensure higher production efficiency, superior compatibility, and outstanding equipment stability.
The extensive use of self-developed components significantly reduces customers’ initial investment costs. With fewer wearing parts and extended service life, the system also minimizes maintenance requirements, helping to lower long-term operational costs.
From advanced hardware to integrated application software and compatible consumables, PIOTEC delivers a complete turnkey card personalization solution. This ensures seamless system coordination while further reducing overall procurement costs and improving production efficiency for users.
Featuring in-house developed high-speed industrial readers, advanced vision systems, and precision laser marking technology, delivering increased production capacity, improved system compatibility, and exceptional operational stability.
The extensive use of in-house developed components significantly reduces initial procurement costs. With fewer wearing parts and longer service life, the system also minimizes maintenance requirements, helping to lower long-term operating costs.
By integrating equipment hardware, application software, and consumables into a unified solution, we enable seamless coordination across the entire system, optimizing efficiency while lowering total cost of ownership.
Proactively engage with customers to understand their needs promptly and resolve issues efficiently, consistently meeting and exceeding their expectations.
Design：The process begins with designing the chip according to the specific application requirements. Key parameters such as memory size, processing power, and security features are determined at this stage.
Wafer Fabrication：The finalized design is transferred onto a silicon wafer through photolithography, a precise process that etches the chip pattern onto the semiconductor material.
Dicing：After fabrication, the wafer is carefully cut into individual chips through a process called dicing, separating each functional unit.
Packaging：Each chip is then packaged to protect it from physical damage and environmental factors. This includes placing the chip in a protective casing and connecting it to the contact points needed for smart card integration.
Testing：Packaged chips undergo rigorous testing to verify their electrical characteristics and ensure they perform all intended functions correctly.
Embedding：Finally, the personalized chips are embedded into smart cards, connecting them to the card’s contact points and preparing them for deployment in secure applications.
Our PTA-8500 series equipment supports large-scale personalized production, including chip data writing for telecommunications cards, surface laser marking, and information verification. The FPL6081 series flexible bank card personalization line can be configured according to specific needs, supporting data writing, lithography, embossing, hot printing, and visual verification. The PTM-120 series handles chip module strip processing, electrical performance testing, and chip initialization.
We provide equipment covering the entire manufacturing process, including stacking, laminating, matting, hot stamping, milling groove packaging, and attaching gold labels, ensuring high-quality card production and efficient workflow.
Our SCM3000 series devices perform electrical performance testing, chip personalization data writing, and surface laser personalization printing for M2M chips. This includes automotive electronics SE (Security Element) chips, eSIMs, and other intelligent devices.
We supply a wide range of materials and equipment for card production, including metal, PC, PETG, PVC, PET, Teslin, and paper cards, as well as personalization equipment supporting data writing, laser printing, and other functions.
We provide all types of financial terminal equipment for banks and other institutions, including instant card issuing systems, deposit/withdrawal machines, cash machines, cash boxes, safes, and more.
Our solutions include die bonders, wire bonders, automatic cutting and sorting systems, precision slicing, thin-film stripping machines, AOI, and other equipment, covering the full semiconductor production workflow.
We also provide industrial intermediate products such as readers, lasers, vision systems, INLAY testers, as well as software platforms including production management, bank card personalized issuance, and financial terminal service systems. Supporting consumables include epoxy films, UV adhesives, DOD inks, ribbons, metal cutter materials, and specialized bank card materials.
Contact Piotec for Smart Card Solution
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