The DCP500 chip programming machine can perform electrical performance testing and personalized data writing on small batches of M2M chips, automotive electronic SE (Security Element - security chips), eSIM and other smart devices in various packaging forms such as DFN, QFN, SOP, VSOP, LQFP, etc.
DCP500 can provide flexible sample card testing and small batch order production solutions for global mobile operators, smart device foundries, and automotive electronic security chip manufacturers.
| Capacity | 500/uph |
| Overall Dimension | 1210mm×930mm×1880mm |
| Weight | 500kg |
| Power Source | 220V（-5%~+10%），50Hz，0.5KW |
| Noise | ＜65dB |
| Operating Temperature | 23℃±3℃ |
| Working Humidity | 50±10% |
| Compressed Air | 0.5Mpa，300L/min |
| Communication Interface | Ethernet |
Equipped with one set of robotic arm for chip picking & placing. Using vacuum adsorption, it can quickly and accurately transport the chip to various stations where the chip is located, avoiding chip damage.
1. Supports tray feeding method: can place 2 trays.
2. Supports feeder feeding method: supports 12mm tape, can be expanded to support 8mm, 16mm, 24mm; compatible with 1000 pieces and 3000 pieces of two types of reels. Compatible with tray/feeder feeding methods.
1. Standard configuration of 2 read-write stations.
2. Standard configuration of 2 Pailitai contact single-head reader-writers PT201NT-AMA. It can perform personalized data writing on the chip, supports 7816, serial port, Bluetooth, SPI and I2C protocols, and can realize online card replenishment function.
Equipped with a set of 5 million pixel CCD industrial cameras and light sources. The direction of the chip Mark point is recognized through the visual recognition system.
Equipped with one chip storage station. Without manual intervention, it can realize automatic rotation of 90° and 180° in the forward and reverse directions, and adjust the chip direction as needed.
1. Equipped with one waste storage box. Chips that fail to write or laser mark can be discarded to the waste storage unit. Receiving Unit:
2. Supports tape feeding method: compatible with 1000 pieces and 3000 pieces of two types of reels. Through hot pressing cover tape, to achieve tape receiving.
High-precision chip handling mechanism, supporting the production of chips as small as 2*2mm.
Supports a dozen types of smart devices in packaging forms such as QFN, DFN, SOP, VSOP, LQFP, etc. Switching between different chip specifications takes only 20 minutes.
Fully supports secondary development to meet various customization needs.
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