The fully automatic cutting and sorting all-in-one machine has a high degree of integration, with a small processing size of 3*3mm and a maximum of 25*25mm, which can meet the micron-level processing requirements for packaging.
Crystal bonding equipment: As a semiconductor chip maker, Piotec's products use a silver glue pick-up device to dispens glue at a given position on the bracket plate, and use a wafer suction device to accurately place and fix the wafer at the glue dispensing location. Including high-speed precision positioning control, visual positioning control, pneumatic suction control and other related technologies for opto-motor integrated systems.
Wire bonding equipment: including image processing, motion control, XYZ platform and network communication, etc., capable of efficient and stable automatic loading, welding and unloading.
Fully automatic wire bonding machines are widely used in internal wire welding of various semiconductors, such as light-emitting diodes (LED LAMPs), digital tubes, SMD chip components, transistors, high-power LEDs, etc. Among them, the LED industry packaging is the most commonly used.
Nowadays, fully automatic wire bonding machines have been widely used in LED industry packaging and are indispensable equipment for LED industry packaging. Since manual and semi-automatic wire bonding machines are inseparable from manual welding, the packaging efficiency and product qualification rate are relatively low, and the production capacity cannot meet the market demand, so they have been gradually replaced by fully automatic wire bonding machines.
Customized solutions can be provided according to customer needs, and multiple types of equipment can be freely combined.
The equipment has a high degree of integration and automation. The fully automatic cutting and sorting all-in-one machine upgrades the original multiple equipment and processes such as film application, dicing, cleaning, UV, demoulding, etc. to be completed by a single equipment.
Including AOI and other independent research and development of many technologies, effectively improving production capacity and stability.
