Chip bonding functions: smart card chip placement, dispensing quality inspection, visual automatic chip alignment and automatic detection of placement accuracy, silver glue thermal curing, base material bad material detection and identification
Wire bonding functions: As a semiconductor chip making company, Piotec's smart card chip bonding, constant temperature control welding head, solder joint accuracy correction
Glue coating and sealing functions: incoming material detection, glue coating, visual positioning, UV curing, thickness measurement, gun waste
Initial data writing and detection functions: data writing, gun scrapping, and broken ribs.
Smart card IC module packaging and testing technology refers to a technology that after the chip is manufactured, the chip is installed into a specific IC packaging module, and then tested and packaged. It mainly includes the following steps:
First, chip manufacturing needs to be carried out, including photolithography, diffusion, etching, cleaning and other processes, to create chips with specific functions and performance.
The manufactured chip is installed into a specific IC packaging module. The material and structure of the packaging module can be selected according to the characteristics and application requirements of the chip.
According to the application requirements of smart cards, design peripheral circuits, including control circuits, storage circuits, input and output circuits, etc.
Conduct comprehensive testing on the smart card system, including functional testing, performance testing, security testing, etc., to ensure that the smart card system meets various standards and requirements.
After completion of testing, the smart card is packaged and delivered to the customer for use.
1. Combined with many years of industry experience, we provide you with the most considerate and cost-effective overall solution for smart card IC module packaging and testing factories.
2. Various types of equipment integrate current mainstream advanced technologies, some of which are exclusive patented technologies, and have been tested by the market for many years. Their compatibility and stability are superior among similar products;
3. Not only provides various types of equipment, but also software (production management system) and supporting consumables (UV glue, etc.)
