SCM3000 can provide high-speed, stable, and secure personalized production services for global automotive electronic Secure Element (SE) chip manufacturers. It supports the production of up to a dozen different chip specifications, with a production switch for different specifications taking just 20 minutes.
With a high-precision mechanical handling mechanism, it can support chips as small as 2*2mm. It supports two material loading and unloading methods: tray and carrier tape. Monthly production can reach up to 1,300,000 chips, with a defect rate below one in a thousand. Over the six years from 2017 to 2023, it has produced nearly 500 million chips for more than a dozen factories.
Building on a foundational software library, SEPP offers personalized services for SE usage in new scenarios like connected car digital keys, domain controllers, V2X, etc. It encompasses support for GP standard command libraries, secure channels, and algorithm libraries. Integration with partner's national cipher HSM allows customers to quickly achieve hardware-based encrypted personalization.
SEPP, the next-gen SE security chip personalization platform, extends beyond basic software libraries to offer tailored services for emerging scenarios like connected car digital keys, domain controllers, and V2X applications.
SEPP's flexibility enables personalized services in various domains, ensuring compatibility with evolving needs such as digital keys, domain control, and V2X. Its comprehensive support for GP standard commands, secure channels, and algorithms enhances its adaptability to emerging trends.
As AI, cloud computing, 5G, and big data mature, intelligent connected vehicles are reshaping the auto industry, ushering in the software-defined automotive era. Industry-wide connectivity presents immense potential, but cybersecurity concerns persist. Vulnerabilities in entertainment systems, communication modules, and more could lead to remote vehicle intrusion. Keyless entry vulnerabilities might allow quick key copying and car theft. App crashes could sever smartphone-vehicle connections, disabling features and trapping owners inside.
Addressing industry hotspots and pain points,Piotec iot chip manufacturer introduced a comprehensive solution for V2X SE (Secure Element) chips. This solution not only provides SE chip programming equipment with years of industry validation but also offers customized software product services to truly deliver an end-to-end security solution tailored to the personalized requirements of V2X SE chips.
The SEPP platform extends beyond traditional card personalization, catering to manufacturers of IoT and connected vehicle SEs, enabling personalized services for various secure chip packaging standards. In comparison to conventional CPS systems, SEPP not only supports SIM card and financial product personalization, but also specializes in M2M, IoT, and V2X SE personalization.
Specification: SEPP encompasses support for SEs ranging from the classic GP2.1.1 and USIM GP2.2 to the latest GP2.3 specifications for IoT and connected vehicles.
Secure Channels: SEPP supports classic SCP02 security protocol as well as the latest SCP03/SCP10/11 protocols for enhanced security.
The solution's hardware platform is powered by PIOTEC's flagship product, the SCM3000 M2M Chip Personalization Data Writing Machine. This device conducts chip electrical testing, personalized data writing, and surface laser printing for M2M chips, automotive electronic SE chips, eSIMs, and more, in packaging forms like QFN, DFN, and VSOP8.
